In short, we have observed the cracking of MoS2 with 1% sulfur vacancy concentration under uniaxial tension. In this study, we found that crack initiation is a competition between two processes: one is the formation of the smallest possible crack at a local site and another is the growth of the crack from that site. As a result, the crack grows step by step, usually along a preferred direction. The dominant direction of the crack growth is determined by the composition and structure of the materials, the applied loads, and the initial crack shape. The extension of the crack surface, as well as the crack propagation rate, are directly determined by the applied loads and the microstructure of the materials. In this study, we observed the formation of Y-shaped cracks with one slip plane and a high propagation rate. The crack propagation is the same as that in PbTe crystals33, which is a typical Y-shaped crack having one slip plane (type 2A). This is confirmed by the fact that the cracks in the MoSe2 samples with different sulfur vacancy concentration grow along the same preferential direction. In addition, the crack growth rate of MoS2 is much higher than that of the MoSe2. This is because the defects in the MoS2 crystals provide many nucleation sites for crack initiation, and hence the nucleation rate is faster than that in the MoSe2 samples. Therefore, the crack grows continuously along the preferred direction at a high rate until it reaches the boundary of the crystal, which leads to the formation of a large crack of a size that cannot be accommodated. This results in the formation of a Y-shaped crack. The size of the crack varies from few tens of nanometers to a few micrometers. Considering the high rate of crack growth, the crack propagation in 2D crystals can be much more effective in reducing the size of Y-shaped cracks than in 3D crystals and hence the crack growth can be more readily controlled. This is a new approach for the fabrication of 2D crack-free materials.
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